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MC32X系列固晶焊線AOI檢測設備

2024-08-23 00:00

適用于半導體封裝D/B后及W/B后兩個站點的外觀檢測，可檢測項目包括芯片偏移、表面缺陷、臟污、崩邊、劃傷等，第一焊點和第二焊點偏移、斷線、錯線、翹線等。可應用于MEMS、LDE、存儲、光通信、功率IC等固晶、焊線后檢測。

Suitable for appearance inspection of two sites after D/B and W/B of semiconductor packaging. The detectable items include chip offset, surface defects, dirt, edge breakage, scratches, etc. The first and second solder joints are offset, broken, misaligned, and curled. Can be applied to MEMS, LDE, storage, optical communication, power IC and other solid crystal and wire bonding post detection.

深入剖析

In depth analysis

級聯(lián)定位，封裝精準

先進封裝基板與芯片偏差，級聯(lián)式順序定位。

Advanced packaging substrate and chip deviation, cascaded sequential positioning.

模板劃定，金線自檢

元件種模板區(qū)域劃定后，自動生成金線檢測區(qū)。

After the template area for component types is defined, a gold wire detection area is automatically generated.

圖像融合，精準提取

多通道的圖像融合，匹配精準目標提取算法。

Multi channel image fusion, matching precise target extraction algorithm.

快搭檢測，應對自如

應對各類半導體 Die Bond、Wire Bond、 Clip Bond后檢測環(huán)境的快速搭建。

Quickly set up post testing environments for various semiconductor Die Bond, Wire Bond, Clip Bond.

一鍵判定，標準自選

絕對式/相對式 NG 判定標準，供客戶一鍵選定。

Absolute/relative NG judgment criteria, available for customers to select with just one click.

金線金球，自動分割

自動分割金線金球，操作便捷。

Automatic segmentation of gold and gold balls, easy to operate.